Technologies

CAPABILITIES

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Specifications Standard Advanced ENGINEERING
Base Material Used FR4 Std; FR4 Mid TG° /Mid TG° HF; FR4 HiTg° (ITEQ, ISOLA, HITACHI); High Speed (NELCO 4000-1 (SI); ISOLA FR408HR / ASTRA / I-TERA; PANASONIC Megtron 6 / Megtron 7) ARLON 33N / 35N / 85N / 85HP; HITACHI MCL-I-671; VENTEC VT901; ISOLA P95/P96; ROGERS ML91/ML92; Thick Copper; Flexible Materials-Polyimide Dupont Pyralux AP/LF/FR; Flexible Material Polyimide Panasonic R-F775; Hi Frequency Teflon and non-Teflon based: Rogers/Arlon RT/Duroid Family, RO3000 family,DiClad family, Cuclad family, Isoclad family, AD family, AR family, TC family, RO4000 family; TACONIC RF25A2, RF35, RF35A2, RF45, RF60, CER10, TLX, TLY, TLE; NELTEC NY9220
PCB Type Rigid; Rigid/Flex; Hybrid Rigid Rigid; Flex; Rigid/Flex (hybrid); Copper/aluminium Heat Sink; Metal Coin Rigid; Flex; Rigid/Flex (hybrid)
 (Teflon+Kapton)
Maximum Number of Layers 16 40 > 40
Maximum Board Dimension 570 x 449 mm 640 x 570 mm 700 x 620 mm
Maximum Board Thickness 3.2 mm 6.5 mm
Minimum core Thickness 0.1 mm 0.05 mm – 0.025 (Flex)
Base Copper Thickness 12 – 18 – 35 – 70 µ 9-12-18-35-70-105-140-210-315 µ > 315 µ and < 9 µ
Aspect Ratio 8:1 12:1 14:1
Minimum Diameter Hole (Mechanical) 0.150 mm 0.127 mm 0.100 mm
Minimum Diameter Hole (Laser) 100 µ 75 µ 60 µ
Holes Position Tolerance ± 0.1 mm
 (from the board edge) ± 0.07 mm on PCB with diagonal < 300 mm (from the board edge)
Minimum Trace 100 µ 75 µ 50 µ
Minimum Space 100 µ 75 µ 50 µ
Plated Hole Tolerance -0.05 ÷ + 0.10 mm -0.05 ÷ + 0.05 mm
Unplated Hole Tolerance 0 ÷ + 0.10 mm 0 ÷ + 0.05 mm
Conformity Certificate On-demand On-demand
Test Certificate On all delivery On all delivery
Production Date (week and year) On solder mask – On copper (on demand) On solder mask – On copper (on demand)
Certification ISO 9001:2015 – EN 9100:2018;
 IATF 16949:2009; Certified: 94V-0 up to 130° ISO 9001:2015 – EN 9100:2018; IATF 16949:2009; Certified: 94V-0 up to 130
Routing Tolerance ± 0.20 mm ± 0.15 mm
Surface Finishes H.A.S.L.; Lead-Free H.A.S.L.; E.N.I.G.; Chemical Tin; OSP; Immersion Silver Electrolytic Ni;
 Electrolytic NiAu; ENEPIG
Solder Mask Types Photographic Photographic – Different Colours
Legend White Data Matrix; QR Code; Legend by Different Colours
Electrical Test (short and open) 100% 100%